Intel will be launching their completely revamped HEDT (high-end desktop) platform later this month. This platform includes the new Haswell-E desktop processors with up to 8 cores along with the new Intel X99 chipset and DDR4 memory. As we have previously reported many times, the Haswell-E processors utilize the newer LGA 2011-3 socket which is slightly different from the previous LGA 2011 socket which was utilized by the Ivy Bridge-E and Sandy Bridge-E chips. In addition to that, Intel has also redesigned the IHS (integrated heat spreader) and now it is soldered to the chip. New high resolution photos of the top of the line Core i7-5960X have leaked.
These photos show the new heat spreader as well as the back side of the CPU. The IHS itself is about the same size as the ones of the Ivy Bridge-E chips but it had small protrusions on top and bottom. Furthermore, the IHS also has a small hole on the top left corner which is for professional overclockers to insert temperature sensors inside for keeping a better track of chip’s thermal activities.
On the bottom, the pin layout has slightly changed as compared to the Ivy Bridge-E and Sandy Bridge-E chips. Furthermore, the number of components at the center of the chip is quite low even when compared to the lower-end Haswell chips but this could be also due to the fact that both use slightly different microarchitecture.
As we have previously reported, the Haswell-E lineup includes three SKUs and the top-end Core i7-5960X comes with 8 cores and 16 threads. This is first time Intel will be offering 8 cores for consumers. Prior to this, the Ivy Bridge-E came with ‘only’ 6 cores. The Core i7-5960X has 3.0 GHz base clock, 20MB L3 cache and 140W TDP. It supports DDR4 memory with up to 2133 MHz speed. Intel is expected to launch the new processors along with the new chipset on August 26, 2014.
Source: Hermitage Akihabara