Intel launched new Haswell-EP Xeon CPUs at IDF 2014 for cloud and dense data center environments. Today, the company has released more information about the upcoming Broadwell-DE CPUs based on the 14 nm manufacturing process. Broadwell-DE also known as BDW-DE will be branded as Xeon D processors and will be implemented as systems-on-chip (SoC) and incorporate new I/O interfaces. New Xeon D microprocessors will launch in the coming months and feature up to 8 cores.
Intel Broadwell-DE Xeon D CPUs; 14 nm, SoC, DDR4 and 12 MB L3 cache
According to a roadmap leaked earlier, Broadwell-DE processors which are designed for low power servers will launch in 2014 along with Atom “Denverton”. Xeon D will not only integrate Broadwell CPU cores and a memory controller but also some I/O interfaces and Platform Controller Hub (PCH). New server microprocessors can feature up to 8 cores with 12 MB L3 cache. The cores support Intel’s Hyper-Threading, Turbo Boost, VT-x and VT-d virtualization, and Trusted Execution technologies. Broadwell-DE also support QuickData technology 3.3 and have AES and AVX2 extensions enabled. A new feature known as Processor Trace will be included in Xeon D which will allow capturing details of code execution, supervisor mode access prevention, and extensions to ADC instruction.
Broadwell-DE aka Xeon D CPUs will include a dual-channel memory controller supporting DDR3L memory up to 1600 MHz and DDR4 memory up to 2133 MHz (2400 MHz on some SKUs). The new CPUs will support up to 128 GB memory if 32 GB memory modules are used. The I/O block includes 10 Gigabit Ethernet controller and 24 PCIe 3.0 lanes. The on-board PCH further adds 8 PCIe 2.0 lanes, 1 Gigabit Ethernet, six SATA 6 GB/s ports, four USB 3.0 ports and four USB 2.0 ports. Xeon D CPUs will be capable to run 64-bit applications and support ECC memory.
There will be two variants of Xeon D SKUs, one for microservers and one for the storage and communications market. Xeon D microprocessors will have a TDP rating ranging from 15-45 W and will be available in BGA packaging only. The processors are sampling now so you can expect more information in the coming weeks.
Source: CPU World