Intel has taken the lead over AMD in terms of performance. Their Sandy Bridge and Ivy bridge processors are leading the market share worldwide. Next in line, Haswell and Broadwell processors are due to launch next year and the year after that. Rumors has it that Broadwell processors will only be available in BGA packages but Intel has denied those rumors and said that they will keep on offering LGA socketed-processors.
Intel has several kinds of processor variants for various users and they are categorized with specific names. Currently there are three packages offered by Intel; desktop LGA (Land Grid Array), mobile PGA (Pin Grid Array) and mobile BGA (Ball grid Array). With the launch of Haswell, Intel will introduce a 4th variant SoC (System on Chip) which will consist of a multi-chip module of the CPU and PCH dies. Right now, SoCs from various companies are widely being used in mobile computing devices like smartphones and tablets but this is a segment Intel hasn’t fully entered yet.
With Sandy and Ivy bridge processors Intel introduced graphics integrated in the processor die named as GT. Intel’s 1M die architecture consist of 2 physical cores and 4MB L3 cache while 2M die has 4 physical cores and 8MB L3 cache. There are three types of IGP modules (GT1, GT2 & GT3); GT2 being the most powerful amongst all. Intel categorized different processors by giving them short prefixes such as:
- DT– Desktop processors such as LGA1155 Ivy Bridge processors
- E– Extreme edition processors such as LGA2011 Core i7-3960X or Core i7-2920XM
- MB– Mobile processors made specifically for laptops such as Ivy Bridge Core i5-3210M
- ULT– Ultra low TDP processors which represents ultra low power consumption and will be named Haswell SoC-ULT
- Code IN (Dual Server), EP (4-way servers) & EX (High-density server)
4th Generation Haswell SoC
The 4th generation Haswell processors are scheduled to be launched in April 2013. According to EX Preview, Haswell SoC will be available in BGA packages and will be named Haswell-H and Haswell-ULT/ULX. BGA packages means that these processors will be integrated on the motherboard. Haswell-H is designed for mini-ITX form factor while Haswell-ULT/ULX are ultra low TDP processors which can be used in tablet PCs for high performance and power efficiency.
5th Generation Broadwell SoC
Broadwell processors are expected to be launched in 2014 and according to EX Preview, Intel will change its naming rules for Broadwell processors.
- DT will be replaced by D, which will represent desktop processors
- Broadwell-H will be mainly used for one machine
- Broadwell-M will represent the mobile processors for notebooks
- ULT will be replaced by U, which will represent ultra-low TDP processors for Ultrabooks
Rumors of LGA and BGA packages might come true with the launch of Broadwell processors since there are no dual-core processors mentioned in LGA1150 socket and are only available in BGA (SoC) variants. So anyone looking to buy a dual-core processor will have to settle with SoC; processor integrated on the motherboard while only high-end quad-core processors will be available in LGA packages.
Source: EX Preview