Intel has been back tracked with its transformation to 14 nm production process. Broadwell CPUs which should have arrived by the end of this year have been moved to Q2 next year. At the same time, Intel is preparing to introduce Skylake-S processors also based on the 14 nm production process but limited to Desktop (LGA) platform only. Fuzilla has secured some interesting information regarding Skylake-S revealing support for DirectX 12, DDR4 memory and 4K resolution.
Intel Skylake-S Desktop CPU; DirectX 12, DDR4, 35-90 W TDP & 4K
Skylake-S processors are only confirmed for desktop at the moment and they will be launched along side Broadwell. In my opinion, Intel will concentrate more on mobile counter parts with Broadwell and Skylake-S will be introduced in LGA packaging only but there is a high possibility that both architectures will co-exist.
Skylake-S will be faster and more optimized compared to Broadwell and it seems like it have a better graphics core as well. The new integrated graphics will support DirectX 12, OpenGL 5.x and OpenCL 2.x. There is an indication that Skylake-S’s GPU core will not fully support all the functions of DirectX 12 but it will indeed support it at a lower level. Apart from that, video encoding will be greatly improved on Skylake-S with the help of the latest generation codecs – HEVC, VP8 and VP9. Intel claims that video encoding efficiency will go all they way up to 8192 x 4320.
From the gaming point of view, Skylake-S will support 4096 x 2304 resolution at 16:10 aspect ratio which should be enough for everyone. Also the integrated graphics will be able to output display to three independent monitors and feature the embedded DisplayPort (eDP). All this performance increase will not compromise the power efficiency instead Skylake-S processors will have a lower TDP compared to Haswell and Broadwell.
Coming towards the CPU side of the things, Fudzilla reports that there is an increase in performance of 10% per core and the overall TDP will improve. Skylake-S will have dual-core and quad-core SKUs with a max TDP of 35 W and 65 W while the high-end CPUs will have a max TDP of 95 W. In order to support Skylake-S CPUs, new motherboards with 100 series chipsets will be required. 100 series chipset line will be lead by 170 express chipset supporting DMI and PCIe 3.0 with up 8 GT/s bandwidth.
In terms of memory support, Skylake-S will initially support both DDR4 and DDR3L memory modules (depending on the motherboard). Motherboard manufacturers need to decide between DDR4 and DDR3L because DDR3L requires 1.35v while DDR4 requires 1.2 v to operate. Although, we can see four DIMM slots with two DDR3L and two DDR4 slots configuration. Skylake-S CPUs will support BCLK overclocking as well as introduce unlocked CPUs in Q4 2015. At the same time, all CPUs will support Intel’s Turbo Boost 2.0 and Hyper Threading technology.